[Edling] Call for Papers: Technology for Second Language Learning Conference
Chapelle, Carol A [ENGL] via Edling
edling at lists.mail.umbc.edu
Fri May 19 21:05:55 UTC 2023
Call for Papers—Submission Deadline May 31, 2023
Technology for Second Language Learning (TSLL) 20th Anniversary Conference
You are invited to submit abstracts describing research investigating the potentials, uses, and implications of AI technologies for language teaching, learning, assessment, and research. The conference theme, “Advancing Technologies – Expanding Research,” signifies the multiple strands of research and practice in applied linguistics affected by current and future artificial intelligence technologies.
Abstracts proposing papers related to the theme are invited for the TSLL conference to be held in hybrid format at Iowa State University on October 20-21, 2023. Accepted papers can be presented in person or remotely. Please find the call for papers, keynote speakers, and submission site here: https://apling.engl.iastate.edu/conferences/technology-for-second-language-learning-conference/tsll-2023/
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://listserv.linguistlist.org/pipermail/edling/attachments/20230519/f16e191d/attachment.htm>
-------------- next part --------------
_______________________________________________
Edling mailing list
Edling at lists.mail.umbc.edu
https://lists.mail.umbc.edu/mailman/listinfo/edling
More information about the Edling
mailing list